IPC-4101 CHINESE
Specification for Base Materials for Rigid and Multilayer Printed Boards
inactive
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| Organization: | IPC |
| Publication Date: | 1 August 2009 |
| Status: | inactive |
| Page Count: | 176 |
scope:
本规范包括了主要用于电气和电子电路中的 刚性及多层印制板的基材(本文指层压板或粘
Document History
March 1, 2017
Specification for Base Materials for Rigid and Multilayer Printed Boards
A description is not available for this item.
IPC-4101 CHINESE
August 1, 2009
Specification for Base Materials for Rigid and Multilayer Printed Boards
本规范包括了主要用于电气和电子电路中的 刚性及多层印制板的基材(本文指层压板或粘 结片,即预浸材料)的要求。