Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
|Publication Date:||1 December 2010|
The IPC-TM-650, Method 2.6.27, is intended to establish a relative ability of printed boards, or representative coupons, to survive the thermal excursions associated with assembly and rework in a tin/lead or lead-free application using a convection oven, or alternate equipment with the capability to match the reflow profile of a convection oven. The test embraces relative robustness of the copper interconnection and dielectric materials subjected to the strain and resulting stress associated with a standardized thermal profile. The purpose is to establish an objective measurement of relative robustness ranking or comparing variables, or establishing minimum reliability requirements for copper interconnections and dielectric material in a printed board. The purpose of the test method is to provide the procedure for conditioning and reflowing of the test specimen prior to evaluation for compliance to the applicable performance specification, i.e., IPC-6012, IPC-6013, IPC-6018, etc.
The primary purpose of this document is to address concerns and considerations related to IPC-TM-650, Method 2.6.27. This document embraces how this test method was intended for use and the rationale behind some of the protocols and requirements. This document provides an adjunct document that improves the understanding, application, and the implication of results from using this test method.