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NPFC - MIL-A-45059

ADHESIVE FOR BONDING CHIPBOARD TO TERNEPLATE, TINPLATE, AND ZINCPLATE

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Organization: NPFC
Publication Date: 4 June 1996
Status: inactive
Page Count: 1
scope:

NOTICE OF CANCELLATION

MIL-A-45059C, including Notice 1, dated 10 May 1989, is hereby canceled without replacement.

Document History

MIL-A-45059
June 4, 1996
ADHESIVE FOR BONDING CHIPBOARD TO TERNEPLATE, TINPLATE, AND ZINCPLATE
NOTICE OF CANCELLATION MIL-A-45059C, including Notice 1, dated 10 May 1989, is hereby canceled without replacement.
MIL-A-45059C VALID NOTICE 1
May 10, 1989
ADHESIVE FOR BONDING CHIPBOARD TO TERNEPLATE, TINPLATE, AND ZINCPLATE
A description is not available for this item.
MIL-A-45059
December 2, 1983
ADHESIVE FOR BONDING CHIPBOARD TO TERNEPLATE, TINPLATE, AND ZINCPLATE
A description is not available for this item.
MIL-A-45059
November 13, 1968
ADHESIVE FOR BONDING CHIPBOARD TO TERNEPLATE, TINPLATE, AND ZINCPLATE
A description is not available for this item.
MIL-A-45059
February 3, 1964
ADHESIVE FOR BONDING CHIPBOARD TO TERNEPLATE, TINPLATE, AND ZINCPLATE
A description is not available for this item.

References

This document references:
PPP-C-96E VALID NOTICE 1 - Cans, Metal, 28 Gage and Lighter
Published by DLA TROOP SUPPORT on February 18, 2022
A description is not available for this item.
This document references:
ASTM D1002 - Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading (Metal-to-Metal)
Published by ASTM on October 1, 2010
This test method covers the determination of the apparent shear strengths of adhesives for bonding metals when tested on a standard single-lap-joint specimen and under specified conditions of...
This document references:
MIL-STD-129R CHANGE 3 - MILITARY MARKING FOR SHIPMENT AND STORAGE
Published by ARMY on February 25, 2023
Purpose. This standard provides the minimum requirements for uniform military marking for shipment and storage. Additional marking may be required by the contract or the cognizant activity....
This document references:
MIL-T-10727 - TIN PLATING: ELECTRODEPOSITED OR HOT-DIPPED, FOR FERROUS AND NONFERROUS METALS
Published by NPFC on February 7, 1997
A description is not available for this item.
This document references:
UU-C-282 - CHIPBOARD
Published by NPFC on June 7, 1977
A description is not available for this item.
This document is referenced by:
ARMY TM 5-625 - REPAIRS AND UTILITIES SHEET METAL
Published by ARMY on April 1, 1964
This manual describes materials, equipment, and methods used to fabricate, repair, replace, and install sheet metal items. The manual is divided as follows. a. Section I gives the introduction to the...
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