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DOD - SMD 5962-96540

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON

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Organization: DOD
Publication Date: 26 January 2011
Status: inactive
Page Count: 30
scope:

This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identification Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.

intended Use:

Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications... View More

Document History

SMD 5962-96540
October 24, 2017
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...
SMD 5962-96540
August 20, 2013
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...
SMD 5962-96540
July 9, 2012
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD 5962-96540
January 26, 2011
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535...
SMD 5962-96540
September 9, 2009
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Replaceability....
SMD-5962-96540 REV E
December 6, 2005
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-96540 REV D
May 26, 2004
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-96540 REV C
January 31, 2002
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-96540 REV B
September 4, 2001
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-96540 REV A
December 10, 1996
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-96540
April 12, 1996
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, DUAL J-K FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
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References

This document references:
ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
Published by ASTM on October 1, 2011
This guide defines the requirements and procedures for testing integrated circuits and other devices for the effects of single event phenomena (SEP) induced by irradiation with heavy ions having an...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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