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DOD - DSCC-VID-V62/11620

MICROCIRCUIT, DIGITAL, CURRENT LIMITED POWER DISTRIBUTION SWITCH, MONOLITHIC SILICON

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Organization: DOD
Publication Date: 5 September 2018
Status: active
Page Count: 14
scope:

This drawing documents the general requirements of a high performance current limited power distribution switch microcircuit, with an operating temperature range of -55°C to +125°C.

Document History

DSCC-VID-V62/11620 REV C
December 12, 2023
MICROCIRCUIT, DIGITAL, CURRENT LIMITED POWER DISTRIBUTION SWITCH, MONOLITHIC SILICON
A description is not available for this item.
DSCC-VID-V62/11620
September 5, 2018
MICROCIRCUIT, DIGITAL, CURRENT LIMITED POWER DISTRIBUTION SWITCH, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance current limited power distribution switch microcircuit, with an operating temperature range of -55°C to +125°C.
DSCC-VID-V62/11620 REV A
November 16, 2017
MICROCIRCUIT, DIGITAL, CURRENT LIMITED POWER DISTRIBUTION SWITCH, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance current limited power distribution switch microcircuit, with an operating temperature range of -55°C to +125°C.
DSCC-VID-V62/11620
October 27, 2011
MICROCIRCUIT, DIGITAL, CURRENT LIMITED POWER DISTRIBUTION SWITCH, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance current limited power distribution switch microcircuit, with an operating temperature range of -55°C to +125°C.

References

This document references:
JEP95 JEDEC STD NO. 95-1 - JEDEC Standard No. 95-1 Section 4 Design Guidelines
Published by JEDEC on March 1, 1997
INTRODUCTION History JEDEC REGISTERED AND STANDARD OUTLINES FOR SEMICONDUCTOR DEVICES, JEDEC PUBLICATION 95, is the official JEDEC Publication that contains the registered or standard mechanical...
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
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