scope:

This part of IEC 63011 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.

3-D IC specifications covered by this document are the following:

• application: digital consumer and mobile;

• operating voltage: 0,1 V to 5,0 V,

• operating frequency: less than 2,0 GHz.

This document does not describe the equipment for the measurement. Figure 1 describes a typical case of multi-chip interconnect system discussed in this document.

Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document