CEI EN 60191-4
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
| Organization: | CEI |
| Publication Date: | 1 October 2018 |
| Status: | active |
| Page Count: | 22 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
FOREWORD
This amendment has been prepared by subcommittee 47D: Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices.
Full information on the voting for the approval of this amendment can be found in the report on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will remain unchanged until the stability date indicated on the IEC website under "http://webstore.iec
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
Document History