CEI EN 60191-4
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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| Organization: | CEI |
| Publication Date: | 1 April 2015 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Semiconductor devices): | 31.080 |
scope:
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.
Document History
October 1, 2018
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
FOREWORD
This amendment has been prepared by subcommittee 47D: Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices.
Full information on the voting for the approval...
CEI EN 60191-4
April 1, 2015
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
December 1, 2002
Normalizzazione meccanica dei dispositivi a semiconduttore - Parte 4: Sistema di codifica e classificazione degli schemi di ingombro per dispositivi a semiconduttore
La presente Norma comprende il testo della Norma CEI EN 60191-4:2000-05 e della sua Modifiche CEI EN 60191-4/A1:2002-12 e CEI EN 60191-4/A2:2002-12, recepite mediante l'annuncio rispettivamente su...