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IPC - J-STD-001 RUSSIAN

Requirements for Soldered Electrical and Electronic Assemblies

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Organization: IPC
Publication Date: 1 April 2010
Status: inactive
Page Count: 84

Document History

J-STD-001 RUSSIAN
July 1, 2014
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001 RUSSIAN
April 1, 2010
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.

References

This document references:
EIA/IPC/JEDEC J-STD-075A - Classification of Passive and Solid State Devices for Assembly Processes
Published by IPC on May 1, 2018
This industry standard outlines worst case industry solder assembly process conditions for passive and solid state electronic devices (hereafter referred to as “devices). This standard provides...
This document references:
J-STD-033 - Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Published by IPC on August 1, 2014
A description is not available for this item.
This document references:
IPC/JEDEC J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by IPC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
This document references:
IPC/ECA J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Published by IPC on January 1, 1992
A description is not available for this item.
This document references:
IPC-TM-650 2.4.22 - Bow and Twist (Percentage)
Published by IPC on June 1, 1999
This test method covers three procedures used to determine the bow and twist percentage of individual rigid printed boards, rigid portions of rigid-flex printed boards, and/or multiple printed...
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