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DSF/FPREN IEC 62148-21

Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch Ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

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Organization: DS
Status: inactive
Page Count: 15
scope:

This part of IEC 62148 cov ers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this edition, the electrical interface for the S-FBGA package is inform ativ e. The purpose of this standard is to specify adequately the electrical interface of PIC packages com posed of optical transmitters and receiv ers that enable mechanical and electrical interchangeability of PIC packages.

Document History

June 7, 2021
Fibre optic active components and devices – Package and interface standards – Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
IEC 62148-21:2021 RLV;which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.;lt;/br;gt;;lt;/br;gt;IEC...
May 6, 2019
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land...
DSF/FPREN IEC 62148-21
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch Ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
This part of IEC 62148 cov ers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch...
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land...
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