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DS/EN IEC 62148-21

Fibre optic active components and devices – Package and interface standards – Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

active, Most Current
Organization: DS
Publication Date: 7 June 2021
Status: active
Page Count: 22
ICS Code (Fibre optic interconnecting devices): 33.180.20
scope:

IEC 62148-21:2021 RLV;which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.;lt;/br;gt;;lt;/br;gt;IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).

Document History

DS/EN IEC 62148-21
June 7, 2021
Fibre optic active components and devices – Package and interface standards – Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
IEC 62148-21:2021 RLV;which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.;lt;/br;gt;;lt;/br;gt;IEC...
May 6, 2019
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land...
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch Ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
This part of IEC 62148 cov ers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch...
Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land...
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