AENOR - UNE-EN 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
inactive
| Organization: | AENOR |
| Publication Date: | 1 December 2007 |
| Status: | inactive |
| Page Count: | 39 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
November 1, 2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
UNE-EN 61190-1-3
December 1, 2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.