scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883,"Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 AD9720 10-Bit, 400 Msps, ECL-Compatible D/A Converter 02 AD9721 10-Bit, 100 Msps, TTL-Compatible D/A Converter

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-M-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 3 CQCC1-N28 28 Leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Positive supply voltage (+V_S) . . . . . . . . . . . +6 V dc Negative supply voltage (−V_S) . . . . . . . . . . . −7 V dc Digital input voltages (D₁ - D₁₀, CLOCK, [C bar][L bar][O bar][C bar][K bar]) Device type 01 . . . . . . . . . . . . . . . . . . 0 to −V_S Device type 02 . . . . . . . . . . . . . . . . . . −0.5 V dc to +V_S Internal reference output current . . . . . . . . . 500 µA Control amplifier input voltage range . . . . . . . 0 V dc to −4.0 V dc Control amplifier output current . . . . . . . . . . ±2.5 mA Reference input voltage (V_REF) . . . . . . . . . . . −3.7 V dc to −V_S Analog output current . . . . . . . . . . . . . . . 30 mA Junction temperature . . . . . . . . . . . . . . . . +175°C Storage Temperature Range (Case) . . . . . . . . . . −65°C to +150°C Lead Temperature (Soldering 10 sec) . . . . . . . . +300°C Thermal resistance, junction-to-case (θ_JC): Case outline X . . . . . . . . . . . . . . . . . . 10°C/W Case outline 3 . . . . . . . . . . . . . . . . . . 13°C/W Thermal resistance, junction-to-ambient (θ_JA): Case outline X . . . . . . . . . . . . . . . . . . 35°C/W Case outline 3 . . . . . . . . . . . . . . . . . . 41°C/W Power dissipation (P_D): Device types 01 . . . . . . . . . . . . . . . . . 1.1 W Device types 02 . . . . . . . . . . . . . . . . . 1.2 W

Operating temperature range . . . . . . . . . . . . −55°C to +125°C Supply voltage range . . . . . . . . . . . . . . . . V_S ±5%

intended Use: