DIN EN 60191-3 Beiblatt 1
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
inactive
| Organization: | DIN |
| Publication Date: | 1 April 2002 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
| ICS Code (Electronics (Vocabularies)): | 01.040.31 |
Document History
August 1, 2006
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
A description is not available for this item.
April 1, 2003
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
A description is not available for this item.
DIN EN 60191-3 Beiblatt 1
April 1, 2002
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
A description is not available for this item.
July 1, 2000
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
A description is not available for this item.
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