DIN EN 60191-3
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
active
| Organization: | DIN |
| Publication Date: | 1 July 2000 |
| Status: | active |
| Page Count: | 46 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
August 1, 2006
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
A description is not available for this item.
April 1, 2003
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
A description is not available for this item.
April 1, 2002
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
A description is not available for this item.
DIN EN 60191-3
July 1, 2000
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
A description is not available for this item.
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