DIN EN 60191-4
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001); German version EN 60191-4:1999 + A1:2002
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| Organization: | DIN |
| Publication Date: | 1 August 2002 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
February 1, 2019
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Dieser Teil von IEC 60191 beschreibt ein Verfahren zur Bezeichnung von Gehäusen und zur Einteilung von Gehäuseformen von Halbleiterbauelementen und ein systematisches Verfahren zur Erzeugung...
April 1, 2017
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/882/CD:2016)
A description is not available for this item.
October 1, 2014
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014
Dieser Teil von IEC 60191 beschreibt ein Verfahren zur Bezeichnung von Gehäusen und zur Einteilung von Gehäuseformen von Halbleiterbauelementen und ein systematisches Verfahren zur Erzeugung...
March 1, 2003
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
A description is not available for this item.
DIN EN 60191-4
August 1, 2002
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001); German version EN 60191-4:1999 + A1:2002
A description is not available for this item.
February 1, 2002
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment A2 (IEC 47D/452/CDV:2001); German version EN 60191-4:1999/prA2:2001
A description is not available for this item.
July 1, 2000
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999); German version EN 60191-4:1999
A description is not available for this item.
References
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