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CEI EN 62047-15

Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass

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Organization: CEI
Publication Date: 1 April 2019
Status: active
Page Count: 4
ICS Code (Other semiconductor devices): 31.080.99

Document History

CEI EN 62047-15
April 1, 2019
Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
A description is not available for this item.
January 1, 2016
Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices...
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