CEI EN 62047-15
Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
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| Organization: | CEI |
| Publication Date: | 1 April 2019 |
| Status: | active |
| Page Count: | 4 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
CEI EN 62047-15
April 1, 2019
Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
A description is not available for this item.
January 1, 2016
Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices...