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CEI EN 62047-15

Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass

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Organization: CEI
Publication Date: 1 January 2016
Status: active
Page Count: 18
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip

Document History

April 1, 2019
Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
A description is not available for this item.
CEI EN 62047-15
January 1, 2016
Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices...

References

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