The bond straps and bosses covered by this specification are intended for, but not limited to, shipboard bonding and grounding applications and as specified for Secure Electrical Information Processing (SEIP) equipment bonding and grounding. Recommended usage should be as follows:

a. Type I - for bonding items in weather-exposed areas where corrosion is a concern.

b. Type II - for lower-impedance bonding items in weather-exposed areas where corrosion is a concern.

c. Type III - for bonding items in non-weather-exposed areas.

d. Type IV - for bonding items in non-weather-exposed areas where corrosion is a concern. Type IV is also for use below deck across sound-dampening devices, in grounding or bonding of ¼-inch stud-mounted equipment, or in grounding or bonding of portable electrical equipment.

e. AL and AL-SGC bosses - for attaching type I straps to aluminum structures.

f. CR and CR-SGC bosses - for attaching type I straps to steel structures.