The bond straps and bosses covered by this specification are intended for, but not limited to, shipboard bonding and grounding applications and as specified for Secure Electrical Information Processing (SEIP) equipment bonding and grounding. Recommended usage should be as follows:

a. Type I -for bonding items in weather exposed areas where corrosion is a concern.

b. Type II - for lower impedance bonding items in weather exposed areas where corrosion is a concern.

c. Type III - for bonding items in non-weather exposed areas.

d. Type IV - for bonding items in non-weather exposed areas where corrosion is a concern. Also for use below deck across sound dampening devices, grounding or bonding of ¼-inch stud mounted equipment, or portable electrical equipment that requires grounding or bonding.

e. AL and AL-SGC Bosses - for attaching Type I straps to aluminum structure.

f. CR and CR-SGC Bosses - for attaching Type I straps to steel structure.