DIN EN 60749-14
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 47/1615/CDV:2002); German version prEN 60749-14:2002
inactive
| Organization: | DIN |
| Publication Date: | 1 September 2002 |
| Status: | inactive |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
July 1, 2004
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003
A description is not available for this item.
DIN EN 60749-14
September 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 47/1615/CDV:2002); German version prEN 60749-14:2002
A description is not available for this item.
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