DIN EN 60749-14
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003
active, Most Current
| Organization: | DIN |
| Publication Date: | 1 July 2004 |
| Status: | active |
| Page Count: | 19 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN EN 60749-14
July 1, 2004
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003
A description is not available for this item.
September 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 47/1615/CDV:2002); German version prEN 60749-14:2002
A description is not available for this item.