DIN EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002
inactive
| Organization: | DIN |
| Publication Date: | 1 January 2003 |
| Status: | inactive |
| Page Count: | 19 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Brazing and soldering): | 25.160.50 |
Document History
November 1, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
Dieser Teil von IEC 61190 legt die allgemeinen Anforderungen zur Beschreibung und Prüfung von Lotpasten fest, die für die Herstellung hochwertiger elektronischer Verbindungen in der Elektronikmontage...
March 1, 2012
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)
A description is not available for this item.
November 1, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007
A description is not available for this item.
DIN EN 61190-1-2
January 1, 2003
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002
A description is not available for this item.
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