DIN EN 61190-1-2/A1
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)
inactive
| Organization: | DIN |
| Publication Date: | 1 March 2012 |
| Status: | inactive |
| Page Count: | 23 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Brazing and soldering): | 25.160.50 |
Document History
November 1, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
Dieser Teil von IEC 61190 legt die allgemeinen Anforderungen zur Beschreibung und Prüfung von Lotpasten fest, die für die Herstellung hochwertiger elektronischer Verbindungen in der Elektronikmontage...
DIN EN 61190-1-2/A1
March 1, 2012
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)
A description is not available for this item.
November 1, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007
A description is not available for this item.
January 1, 2003
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002
A description is not available for this item.
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