DIN IEC 60749-37
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method of components for handheld electronic products (IEC 47/1824/CD:2005)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 December 2005 |
| Status: | inactive |
| Page Count: | 37 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN IEC 60749-37
December 1, 2005
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method of components for handheld electronic products (IEC 47/1824/CD:2005)
A description is not available for this item.
References
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