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BSI - BS EN IEC 62148-19

Fibre optic active components and devices - Package and interface standards Part 19: Photonic chip scale package

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Organization: BSI
Publication Date: 31 July 2019
Status: active
Page Count: 44
ICS Code (Fibre optic interconnecting devices): 33.180.20

Document History

BS EN IEC 62148-19
July 31, 2019
Fibre optic active components and devices - Package and interface standards Part 19: Photonic chip scale package
A description is not available for this item.

References

This document references:
EN IEC 61281-1 - Fibre optic communication subsystems - Part 1: Generic specification
Published by CENELEC on March 1, 2018
This part of IEC 61281 is a generic specification for fibre optic communication subsystems (FOCSs). The parameters defined herein form a specifiable minimum set of specifications that are common to...
This document references:
EN IEC 62148-1 - Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance
Published by CENELEC on February 1, 2018
This part of IEC 62148 aims to assure interchangeability in physical interfaces between fibre optic active components and devices supplied by different manufacturers, but it does not guarantee...
This document references:
EN IEC 62148-21 - Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Published by CENELEC on June 1, 2021
This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch...
This document references:
IEC 61281-1 - Fibre optic communication subsystems - Part 1: Generic specification
Published by IEC on December 1, 2017
This part of IEC 61281 is a generic specification for fibre optic communication subsystems (FOCSs). The parameters defined herein form a specifiable minimum set of specifications that are common to...
This document references:
IEC 62148-1 - Fibre Optic Active Componets and Devices - Package and Interface Standards - Part 1: General and Guidance
Published by IEC on August 1, 2017
This part of IEC 62148 aims to assure interchangeability in physical interfaces between fibre optic active components and devices supplied by different manufacturers, but it does not guarantee...
This document references:
62148-21 - Fibre optic active components and devices – Package and interface standards – Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Published by IEC on April 1, 2021
This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch...
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