DIN EN 60068-2-58
Environmental testing - Part 2-58: Tests; test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:1999); German version EN 60068-2-58:1999
inactive
| Organization: | DIN |
| Publication Date: | 1 October 1999 |
| Status: | inactive |
| ICS Code (Environmental testing): | 19.040 |
Document History
July 1, 2011
Environmental testing - Part 2-58: Test - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 91/963/CD:2011)
A description is not available for this item.
March 1, 2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004
A description is not available for this item.
DIN EN 60068-2-58
October 1, 1999
Environmental testing - Part 2-58: Tests; test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:1999); German version EN 60068-2-58:1999
A description is not available for this item.
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