DIN EN 60068-2-58
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 March 2005 |
| Status: | inactive |
| Page Count: | 27 |
| ICS Code (Environmental testing): | 19.040 |
Document History
July 1, 2011
Environmental testing - Part 2-58: Test - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 91/963/CD:2011)
A description is not available for this item.
DIN EN 60068-2-58
March 1, 2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004
A description is not available for this item.
October 1, 1999
Environmental testing - Part 2-58: Tests; test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:1999); German version EN 60068-2-58:1999
A description is not available for this item.