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DIN EN 61191-3

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017

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Organization: DIN
Publication Date: 1 May 2018
Status: active
Page Count: 21
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

Dieser Teil von IEC 61191 legt die Anforderungen an die Lötmontage von Baugruppen in Durchstecktechnik fest. Die Anforderungen beziehen sich auf Baugruppen, die ausschließlich in Durchsteck-Montagetechnik aufgebaut sind, und auf die für die Durchsteckmontage vorgesehenen Teile von Baugruppen, die weitere verwandte Techniken (z. B. Oberflächenmontage, Chipmontage, Lötstützpunktmontage) umfassen

Document History

DIN EN 61191-3
May 1, 2018
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Dieser Teil von IEC 61191 legt die Anforderungen an die Lötmontage von Baugruppen in Durchstecktechnik fest. Die Anforderungen beziehen sich auf Baugruppen, die ausschließlich in...
DIN EN 61191-3
January 1, 2016
Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)
A description is not available for this item.
DIN EN 61191-3
June 1, 1999
Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998); German version EN 61191-3:1998
A description is not available for this item.

References

This document references:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
IPC-A-610 GERMAN - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
DIN EN 60068-2-20 - Umgebungseinfluesse - Teil 2-20: Pruefungen - Pruefung T: Pruefverfahren fuer die Loetbarkeit und Loetwaermebestaendigkeit von Bauelementen mit herausgefuehrten Anschluessen (IEC 60068-2-20:2008); Deutsche Fassung EN 60068-2-20:2008
Published by DIN on February 1, 2009
A description is not available for this item.
This document references:
DIN EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004
Published by DIN on March 1, 2005
A description is not available for this item.
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