DIN EN 61191-3
Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998); German version EN 61191-3:1998
inactive
| Organization: | DIN |
| Publication Date: | 1 June 1999 |
| Status: | inactive |
| Page Count: | 13 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
May 1, 2018
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Dieser Teil von IEC 61191 legt die Anforderungen an die Lötmontage von Baugruppen in Durchstecktechnik fest. Die Anforderungen beziehen sich auf Baugruppen, die ausschließlich in...
January 1, 2016
Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)
A description is not available for this item.
DIN EN 61191-3
June 1, 1999
Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998); German version EN 61191-3:1998
A description is not available for this item.
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