DIN EN 61191-3
Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)
inactive
| Organization: | DIN |
| Publication Date: | 1 January 2016 |
| Status: | inactive |
| Page Count: | 32 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
May 1, 2018
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Dieser Teil von IEC 61191 legt die Anforderungen an die Lötmontage von Baugruppen in Durchstecktechnik fest. Die Anforderungen beziehen sich auf Baugruppen, die ausschließlich in...
DIN EN 61191-3
January 1, 2016
Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)
A description is not available for this item.
June 1, 1999
Printed board assemblies - Part 3: Sectional specification: Requirements for through-hole mount soldered assemblies (IEC 61191-3:1998); German version EN 61191-3:1998
A description is not available for this item.