DIN IEC 47/1425/CD
Amendment to IEC 60749 "Update of Chapter 2 subclause 2.3: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat" and of Chapter 3 clause 5: "Sealing"
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 November 1998 |
| Status: | inactive |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
DIN IEC 47/1425/CD
November 1, 1998
Amendment to IEC 60749 "Update of Chapter 2 subclause 2.3: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat" and of Chapter 3 clause 5: "Sealing"
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References
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