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DIN EN 60749

Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001

inactive, Most Current
Organization: DIN
Publication Date: 1 September 2002
Status: inactive
ICS Code (Semiconductor devices in general): 31.080.01

Document History

DIN EN 60749
September 1, 2002
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001
A description is not available for this item.
DIN EN 60749
September 1, 2001
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000); German version EN 60749:1999 + A1:2000
A description is not available for this item.
DIN EN 60749
February 1, 2000
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996); German version EN 60749:1999
A description is not available for this item.

References

This document is replaced by:
DIN EN 60749-2 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002
Published by DIN on April 1, 2003
A description is not available for this item.
This document is replaced by:
DIN EN 60749-5 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017); German version EN 60749-5:2017
Published by DIN on January 1, 2018
Dieser Teil der IEC 60749 stellt für die Beurteilung der Zuverlässigkeit nicht hermetisch verkappter Halbleiterbauelemente ein Lebensdauer-Prüfverfahren sowohl bei konstanter Wärme als auch Feuchte...
This document is replaced by:
DIN EN 60749-22 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003
Published by DIN on December 1, 2003
A description is not available for this item.
This document is replaced by:
DIN EN 60749-12 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2002); German version EN 60749-12:2002
Published by DIN on April 1, 2003
A description is not available for this item.
This document is replaced by:
DIN EN 60749-31 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003
Published by DIN on December 1, 2003
A description is not available for this item.
This document is replaced by:
DIN EN 60749-3 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017
Published by DIN on January 1, 2018
Zweck dieses Teils der IEC 60749 ist der Nachweis, dass die Werkstoffe, die konstruktive Gestaltung, der Aufbau, die Kennzeichnung und die Verarbeitung eines Halbleiterbauelements der anzuwendenden...
This document is replaced by:
DIN EN 60749-6 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017
Published by DIN on November 1, 2017
Zweck dieses Teils der IEC 60749 ist es, die Wirkung erhöhter Temperatur auf alle elektronischen Halbleiterbauelemente bei ihrer Lagerung ohne elektrische Beanspruchung zu prüfen und zu bestimmen....
This document is replaced by:
DIN EN 60749-9 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017
Published by DIN on November 1, 2017
Zweck dieses Teils der IEC 60749 ist es, zu bestimmen, ob die Kennzeichnungen auf festen Halbleiterbauelementen lesbar bleiben, wenn darauf Etiketten geklebt und wieder entfernt werden oder die...
This document is replaced by:
DIN EN 60749-25 - Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
Published by DIN on April 1, 2004
A description is not available for this item.
This document is replaced by:
DIN EN 60749-36 - Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003
Published by DIN on December 1, 2003
A description is not available for this item.
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