scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 TLC7705 Micropower supply voltage supervisor

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1 -T8 or CDIP2-T8 8 dual-in-line 2 CQCC1 -N20 20 square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_DD).................................................................. +7.0 V dc 4/ Input voltage range, CONTROL, [R bar][E bar][S bar][I bar][N bar], SENSE ........................................... −0.3 V dc to +7.0 V dc 4/ Maximum low output current, (I_OL)..................................................... 10 mA Maximum high output current, (I_OH).................................................... −10 mA Input clamp current (I_IK) (V_IN < 0.0 or V_IN > V_DD).................................... ±10 mA Output clamp current (I_OK) (V_OUT < 0.0 or V_OUT > V_DD)................................. ±10 mA Continuous total power dissipation (T_A ≤ 25°C)........................................ 1 W Junction temperature (T_J)............................................................. 150°C Operating free-air temperature range, (T_A)............................................ −55°C to +125°C Storage temperature range, (T_STG)..................................................... −65°C to +150°C Thermal resistance, junction to ambient (θ_JA): Case P............................................................................. 180°C/W Case 2............................................................................. 65°C/W Thermal resistance, junction to case (θ_JC)............................................ See MIL-STD-1835

Supply voltage range (V_DD)............................................................ +2.0 V dc to +6.0 V dc Input voltage range (V_I).............................................................. (0 to V_DD) V High level input voltage at RESIN and CONTROL, (V_IH):................................. (0.7 × V_DD) V min 5/ Low level input voltage at RESIN and CONTROL, (V_IL):................................. (0.2 × V_DD) V max 5/ High level output current (I_OH) (V_DD ≥ 2.7 V):........................................ −2 mA max Low level output current (I_OL) (V_DD ≥ 2.7 V):......................................... 2 mA max Input transition rise and fall rate at RESIN and CONTROL, (Δt/ΔV):................... 100 ns/V max Operating free-air temperature range (T_A)............................................. −55°C to +125°C

intended Use: