DIN IEC 47D/301/CD
Mechanical standardization of semiconductor devices, common package unit design guide for 1,50 mm, 1,27 mm and 1,00 mm ball-grid-terminal-packages (IEC 47D/301/CD:1999)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 January 2000 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47D/301/CD
January 1, 2000
Mechanical standardization of semiconductor devices, common package unit design guide for 1,50 mm, 1,27 mm and 1,00 mm ball-grid-terminal-packages (IEC 47D/301/CD:1999)
A description is not available for this item.
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