DIN EN 60191-6-2
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
active, Most Current
| Organization: | DIN |
| Publication Date: | 1 September 2002 |
| Status: | active |
| Page Count: | 14 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN EN 60191-6-2
September 1, 2002
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
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