DIN IEC 60191-6-19
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 March 2008 |
| Status: | inactive |
| Page Count: | 48 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 60191-6-19
March 1, 2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
A description is not available for this item.
References
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