JEDEC J-STD-035
Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
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| Organization: | JEDEC |
| Publication Date: | 1 May 1999 |
| Status: | active |
| Page Count: | 18 |
scope:
This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compound voids, etc.) nondestructively in plastic packages while achieving reproducibility.
Document History
December 1, 2022
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic devices. This method provides users with an acoustic microscopy process flow for...
JEDEC J-STD-035
May 1, 1999
Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for...
April 1, 1999
Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. This method provides users with an acoustic microscopy process reflow...