scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 56001-20 56-bit general purpose DSP

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X P-AE (88-Pin, 1.380" × 1.380" × .345"), pin grid array package Y See figure I (100-terminal, 0.960" × 0.960" × 0.135"), leaded chip carrier package

Supply voltage range with respect to GND (V_CC) - - - - - - - - −0.3 V dc to +7.0 V dc Input voltage (V_IN)- - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC Storage temperature range- - - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation- - - - - - - - - - - - - - - - - - - 1.1 W Maximum operating temperature (T_C) - - - - - - - - - - - - - - −55°C to +125°C Lead temperature (soldering, 5 seconds)- - - - - - - - - - - - +270°C Junction temperature (T_J)- - - - - - - - - - - - - - - - - - - +150°C Thermal resistance, Junction-to-case (θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case Y - - - - - - - - - - - - - - - - - - - - - - - - - - - 10°C/W

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - - - 4.5 V dc to +5.5 V dc High level input voltage (V_IH) - - - - - - - - - - - - - - - - 2 V dc to V_CC Low level input voltage (V_IH)- - - - - - - - - - - - - - - - - −0.5 V dc to 0.8 V dc Minimum high level output voltage (V_OH)- - - - - - - - - - - - 2.4 V dc Maximum low level output voltage (V_OL) - - - - - - - - - - - - 0.8 V dc Frequency of operation - - - - - - - - - - - - - - - - - - - - 4.0 to 20.5 MHz Case operating temperature - - - - - - - - - - - - - - - - - - −55°C to +125°C

intended Use: