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BSI - BS DD IEC/PAS 62647-3

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder Part 3: Performance testing for systems containing lead-free solder and finishes

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Organization: BSI
Publication Date: 30 September 2011
Status: inactive
Page Count: 44
ICS Code (Production. Production management): 03.100.50
ICS Code (Electronic components in general): 31.020
ICS Code (Aerospace electric equipment and systems): 49.060

Document History

BS DD IEC/PAS 62647-3
September 30, 2011
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder Part 3: Performance testing for systems containing lead-free solder and finishes
A description is not available for this item.
BS PD IEC/TS 62647-3
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder Part 3: Performance testing for systems containing lead-free solder and finishes
A description is not available for this item.

References

This document references:
IPC/JEDEC-9703 - Mechanical Shock Test Guidelines for Solder Joint Reliability
Published by IPC on March 1, 2009
This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level. The three main categories...
This document references:
MIL-STD-810 - ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
Published by NPFC on January 31, 2019
Purpose. This Standard contains materiel acquisition program planning and engineering direction for considering the influences that environmental stresses have on materiel throughout all phases of...
This document references:
MIL-HDBK-217 - RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT
Published by NPFC on July 10, 1992
Purpose - The purpose of this handbook is to establish and maintain consistent and uniform methods for estimating the inherent reliability (i.e., the reliability of a mature design) of military...
This document references:
IEC/TS 62647-1 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
Published by IEC on August 1, 2012
This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing...
This document references:
IEC/TS 62647-2 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin
Published by IEC on November 1, 2012
This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is...
This document is referenced by:
BS PD IEC/TS 62647-1 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder Part 1: Preparation for a lead-free control plan
Published by BSI on November 30, 2012
A description is not available for this item.
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