IEC/TS 62647-2
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin
active, Most Current
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| Organization: | IEC |
| Publication Date: | 1 November 2012 |
| Status: | active |
| Page Count: | 72 |
| ICS Code (Production. Production management): | 03.100.50 |
| ICS Code (Electronic components in general): | 31.020 |
| ICS Code (Aerospace electric equipment and systems): | 49.060 |
scope:
This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.
This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.
This document may be used by other high-performance and high-reliability industries, at their discretion.
Document History
IEC/TS 62647-2
November 1, 2012
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin
This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.
This Technical Specification is...
June 1, 2011
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
This PAS establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems.
This PAS is applicable to Aerospace and High...