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JSA - JIS C 61191-3

Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies

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Organization: JSA
Publication Date: 23 March 2020
Status: active
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

JIS C 61191-3
March 23, 2020
Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies
A description is not available for this item.
JIS C 61191-3
March 25, 2006
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
A description is not available for this item.

References

This document is referenced by:
JIS C 60068-2-20 - Environmental testing - Part 2-20: Tests-Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Published by JSA on May 20, 2010
This Standard outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in JIS C 60068-2-58. This Standard provides procedures for...
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