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ECIA - EIA-364-61

TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards

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Organization: ECIA
Publication Date: 1 May 2014
Status: active
Page Count: 18
scope:

This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain / wave solder, or hot gas / vapor techniques. It is important to note that compliant pin connectors or sockets can be affected by solder rework if they are in close proximity to other connectors or sockets undergoing solder rework.

Document History

EIA-364-61
May 1, 2014
TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain / wave solder,...
May 1, 2014
TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain / wave solder,...
February 1, 2013
TP-61 Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain, or hot gas /...

References

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