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BSI - BS EN IEC 61191-1 - TC

Tracked Changes (Redline) - Printed board assemblies Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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Organization: BSI
Publication Date: 27 February 2020
Status: active
Page Count: 109
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN IEC 61191-1 - TC
February 27, 2020
Tracked Changes (Redline) - Printed board assemblies Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
A description is not available for this item.

References

This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
J-STD-001 - Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
Published by IPC on February 1, 2020
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G and IPC-A-610G to ensure the reliability of mission-critical soldered...
This document references:
IEC 61190-1-1 - Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by IEC on March 1, 2002
A description is not available for this item.
This document references:
IEC 61191-2 - PRINTED BOARD ASSEMBLIES – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
Published by IEC on September 1, 2019
A description is not available for this item.
This document references:
IEC 61188-7 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Published by IEC on April 1, 2017
This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data...
This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 61188-7 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Published by IEC on April 1, 2017
This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data...
This document references:
IEC 61190-1-1 - Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by IEC on March 1, 2002
A description is not available for this item.
This document references:
IEC 61191-2 - PRINTED BOARD ASSEMBLIES – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
Published by IEC on September 1, 2019
A description is not available for this item.
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