BSI - BS EN 61191-3 - TC
Tracked Changes (Redline) - Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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| Organization: | BSI |
| Publication Date: | 26 February 2020 |
| Status: | active |
| Page Count: | 61 |
| ICS Code (Printed circuits and boards): | 31.180 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
BS EN 61191-3 - TC
February 26, 2020
Tracked Changes (Redline) - Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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