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ASTM International - ASTM F375-20

Standard Specification for Integrated Circuit Lead Frame Material

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Organization: ASTM International
Publication Date: 1 September 2020
Status: active
Page Count: 3
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling.

1.2 The metals that are applicable to these parts include copper and copper alloys, ferrous alloys usually containing nickel or cobalt or chromium, nickel and nickel alloys, and other metallic materials.

1.3 The general chemical, physical, and mechanical property requirements of these materials are covered by other ASTM specifications (specifically Specifications B103/B103M, B122/B122M, B152/B152M, B162, B465, F15, F30, F31, F49 and F68), and these should be consulted for properties and tempers that are different for the different metals. For metals for which no ASTM specification is available, other specifications should be adopted by agreement of the parties concerned.

1.4 The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard.

1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

abstract:

This specification covers the special requirements for a metal strip used in the fabrication of integrated-circuit lead frames by stamping or photochemical milling. The metal strip shall be... View More

Document History

ASTM F375-20
September 1, 2020
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
July 1, 2015
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
October 1, 2010
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
January 1, 2005
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
January 1, 1999
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
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