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ASTM International - ASTM F375-89(2010)

Standard Specification for Integrated Circuit Lead Frame Material

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Organization: ASTM International
Publication Date: 1 October 2010
Status: inactive
Page Count: 3
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling.

1.2 The metals that are applicable to these parts include copper and copper alloys, ferrous alloys usually containing nickel or cobalt or chromium, nickel and nickel alloys, and other metallic materials.

1.3 The general chemical, physical, and mechanical property requirements of these materials are covered by other ASTM specifications (specifically Specifications B103/B103M, B122/B122M, B152/B152M, B162, B465, F15, F30, F31, and F68), and these should be consulted for properties and tempers that are different for the different metals. For metals for which no ASTM specification is available, other specifications should be adopted by agreement of the parties concerned.

1.4 TThe values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

abstract:

This specification covers the special requirements for a metal strip used in the fabrication of integrated-circuit lead frames by stamping or photochemical milling. The metal strip shall be... View More

Document History

September 1, 2020
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
July 1, 2015
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
ASTM F375-89(2010)
October 1, 2010
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
January 1, 2005
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
January 1, 1999
Standard Specification for Integrated Circuit Lead Frame Material
1.1 This specification covers the special requirements for metal strip to be used to fabricate integrated-circuit lead frames by stamping or photochemical milling. 1.2 The metals that are applicable...
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