DSF/PREN IEC 62878-2-602
Device Embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
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| Organization: | DS |
| Status: | active |
| Page Count: | 14 |
scope:
This document specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic module.
Document History
August 17, 2021
Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
DSF/PREN IEC 62878-2-602
Device Embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
This document specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic module.