DS/EN IEC 62878-2-602
Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
active, Most Current
| Organization: | DS |
| Publication Date: | 17 August 2021 |
| Status: | active |
| Page Count: | 22 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Document History
DS/EN IEC 62878-2-602
August 17, 2021
Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Device Embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
This document specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic module.