ETSI - TS 103 666-2
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
inactive
| Organization: | ETSI |
| Publication Date: | 1 September 2020 |
| Status: | inactive |
| Page Count: | 97 |
scope:
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of the generic SSP specified in ETSI TS 103 666-1 [3].
Document History
August 1, 2022
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...
TS 103 666-2
September 1, 2020
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...
June 1, 2020
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...
February 1, 2020
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...
November 1, 2019
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...