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ETSI - TS 103 666-2

Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics

active, Most Current
Organization: ETSI
Publication Date: 1 September 2020
Status: active
Page Count: 97
scope:

The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of the generic SSP specified in ETSI TS 103 666-1 [3].

Document History

TS 103 666-2
September 1, 2020
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...
June 1, 2020
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...
February 1, 2020
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...
November 1, 2019
Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC, also known as iSSP. The present document defines specific attributes on top of...

References

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